Which products can silicone thermal conductive heat dissipation materials be used in the electronics market in 2025?
2025-01-02
Cmai International Limited development plan for silicone thermal conductive and heat dissipation materials in 2025
Silicone thermal conductive and heat dissipation materials are widely used in the electronic original parts market. These materials are essential to ensure the performance, reliability and service life of electronic equipment. The following is a detailed introduction to the application of thermal conductive and heat dissipation materials in the electronic original parts market:
一、Consumer electronics
1.Smartphone：
Smartphones contain many components that generate heat, such as processors, screens, camera modules, and power management modules. As smartphones become increasingly powerful, the increase in heat generated by internal devices makes heat dissipation issues increasingly important. Traditional smartphones usually use a "Thermal interface material + graphite film" heat dissipation solution. In recent years, with the increase in smartphone performance and power consumption, the penetration rate of high-efficiency heat dissipation materials such as heat pipes and vapor chambers in the smartphone field has continued to increase, and thermally conductive silicone gaskets have gradually developed into the mainstream heat dissipation solution for mid- to high-end smartphones.
2.Laptop：
The two main heat generating cores inside a laptop are the CPU and GPU, which generate a lot of heat under high-speed computing. If the heat is not dissipated in time, the core components may be burned out, which is one of the main reasons for laptop failures. At present, laptops usually use a combination of thermal conductive interface materials (Silicone thermal pads), graphite films, heat pipes and cooling fans to dissipate heat. With the increasing demand for light and thin carrying, work and daily entertainment, the high performance and light and thin development of silicone thermal pads will give rise to more demand for heat dissipation materials in the laptop field.
二、Other electronic fields
1.Industrial Switches：
In order to meet the reliability application requirements, most industrial switches adopt fan less heat dissipation design. For chips with relatively high heat generation, thermal conductive silicone gaskets, thermal conductive phase change materials, etc. can be used to fill the gaps on the contact surface to form a heat conduction channel from the chip surface to the shell. Silicone thermal conductive gaskets can make the switch work reliably and safely in high temperature environments.
2.Game consoles：
Sony's PlayStation 5 uses liquid metal thermal interface material (TIM) on the main processor to transfer the huge amount of heat generated to the radiator. The silicone thermal gasket can speed up the heat dissipation of the device and ensure that the game console can run reliably for a long time under high-performance conditions.
3.LED lighting system：
Thermally conductive silicone is also widely used in the field of LED lighting heat dissipation. Many internationally renowned companies have launched their own composite thermally conductive silicone series, and can also use silicone thermal conductive gasket materials. Most of these products use engineering plastics and general silicone as the base material, and improve thermal conductivity through modification to meet the heat dissipation needs of LED lighting.
三、Specific types of thermally conductive heat dissipation materials
1.Thermally conductive silicone pad: Designed to solve the problem of heat transfer in gaps, it can effectively fill and bridge the tiny gaps between heating elements and heat dissipation components to achieve efficient heat conduction. At the same time, it has multiple functions such as insulation, shock absorption, and sealing, and perfectly fits the design trend of miniaturization and ultra-thinness of modern electronic equipment.
2.Thermal grease: Based on organic silicone, it is integrated with high-performance heat-resistant and thermally conductive materials to form an organic silicone grease composite, which is widely used in heat dissipation management of power amplifiers, transistors, electron tubes, CPUs and other components.
3.Thermally conductive double-sided tape: It is made of acrylic polymer and thermally conductive ceramic powder. It has high thermal conductivity, insulation, excellent flexibility, compressibility, conformability and strong adhesion. It is suitable for a wide temperature range, can effectively fill uneven surfaces, and fit closely to heat sources and heat sinks.
4.Graphite wrapped foam: Made with special processes and advanced technology, it is an ideal material for specific application scenarios due to its excellent thermal conductivity and low resistance. It has high thermal conductivity, thin thickness, high cost performance, and is particularly good at longitudinal heat conduction, which can quickly eliminate hot spots.
5.Thermal paste: According to customer needs, it can be customized into a highly compressible sheet or semi-fluid state to meet the requirements of automatic dispensing process. It exhibits good thermal conductivity and excellent gap filling ability, and is an effective tool for dealing with complex heat dissipation problems.
6.Thermally conductive potting glue: specially designed for electronic components with high heat dissipation requirements. After curing, it exhibits excellent thermal conductivity, insulation and electrical properties, and also has good adhesion and surface gloss.
Thermally conductive and heat dissipating materials have broad application prospects and important value in the electronic original parts market. With the continuous development and performance improvement of electronic equipment, the demand for thermally conductive and heat dissipating materials will continue to grow. In terms of technology research and development, Changmai International Limited will focus on R&D investment in silicone thermal conductive materials. We have a professional R&D team that constantly explores the application of new technologies and new materials in silicone thermal conductive gaskets. We maintain close cooperation with many scientific research institutions and universities to jointly carry out technology research and development and achievement transformation to ensure that our products always maintain the leading level in the industry. In terms of market expansion, we have established a relatively complete sales network and channel system, actively expanding domestic and foreign markets, and increasing brand awareness and influence. At the same time, we also focus on communication and cooperation with customers, and strive to provide personalized solutions to meet the needs of different customers.
