China Suppliers Factory Custom Silicone Rubber Thermal Conductive Pads for Optimal Heat Dissipation
Product Introduction
This high-strength thermal interface material is made by coating a thermally conductive polymer onto a glass fiber silicone cloth substrate. It is easy to process and assemble, and its softness and high conformability make it suitable for filling air gaps between PC motherboards and heat sinks or metal chassis. Its viscoelastic properties make it suitable for low-stress shock absorption and buffering. Its single-sided adhesive and puncture resistance make it an excellent electrical insulating material, suitable for filling and insulating active heaters or those with irregular pins. It can also be used for insulating high-voltage bare-wire devices and heat sinks.
Product Physical Property Table
| Product physical property table | |||
| Test project | Unit | LP120 | Test Method |
| Color | - | White/ Pink | Visual |
| Thickness | m m | 0.3-10 | ASTM D374/374M |
| Hardness | Shore A0 | 30±5 | GB/T531 |
| Specific Gravity | g/cm3 | 2.07 | ASTM D792 |
| Tensile Strength | Mpa | 2.5 | ASTM D412 |
| Elongation at Break | % | 100 | ASTM D412 |
| Tear Strength | KN/m | 4.2 | ASTM D624 |
| Breakdown Voltage | KV/mm | ≥10 | ASTM D149 |
| Volume Resistivity | Ω-cm | 1x1013 | ASTM D257 |
| Temperature Resistance Range | ℃ | -40~150 | - |
| Fire Resistance Performance | - | V-0 | UL 94 |
| Weight Loss | % | ≤0.3 | @150℃240H |
| Dielectric Constant | @1MHz | 5.41 | ASTM D150 |
| Thermal Conductivity | W/m·K | 1.2 | IS0 22007-2 |
| Thermal Impedance | ℃·in2/w | 1.108 | ASTM D5470 |
Applications
And other applications where heat needs to be transferred to racks and chassis.
Product Features
- Enhanced puncture resistance, shear resistance and tear resistance
- Only one side is sticky
- High conformability, low hardness, high strength
Main Categories
- Thermal pad
- High thermal conductivity silicone pad
- Ultra-high thermal conductivity silicone pad
- Thermal conductive pad with silicone rubber cloth
- With glass fiber thermal pad
- Covered with Single Sided Tape Thermal Pad
Download
Thermal pad--CMAl Catal
Frequently Asked Questions
Silicone thermal pad is a soft thermal conductive medium made of silicone rubber as the base and filled with high thermal conductivity insulating materials. It is specially used for heat transfer between heat-generating components and heat sinks in electronic equipment. Its core function is to fill the microscopic gaps on the contact surface, reduce the interface thermal resistance, and thus efficiently conduct heat, while providing electrical insulation and mechanical buffer protection.
1. Thermal conductivity (thermal conductivity): The higher the thermal conductivity, the lower the thermal resistance and the better the thermal conductivity.
2. Thickness: The thickness of the thermal conductive silicone pad will affect its thermal resistance and heat dissipation effect. Thinner thermal conductive silicone pads have low thermal resistance and good heat transfer effect.
3. Hardness and softness: Gaskets with low hardness and good softness are easier to fit the surface of the radiator or heat source, reduce contact thermal resistance and improve heat dissipation effect.
4. Working temperature range: Different equipment has different working temperature requirements. When choosing a thermal conductive silicone pad, ensure that its working temperature range is suitable for the equipment's use environment.
Other factors: The pressure resistance, toughness, silicone oil content, voltage resistance, fire rating and other factors of the thermal conductive silicone pad.
Thermal conductive pads are widely used in many fields such as electronic products, medical applications, automotive industry, aerospace, home appliances, power supply industry, LED industry and PC equipment.
1. Type and characteristics of polymer matrix materials: The higher the thermal conductivity of the matrix material, the better the thermal conductivity is generally.
2. Type, shape and content of fillers: The higher the thermal conductivity of the filler, the better the thermal conductivity of the thermally conductive composite material. The order of the shape of the filler to form a thermal conductive path is: whisker > fiber > flake > granular.
3. Humidity: The higher the humidity, the worse the thermal conductivity.
4. Thickness: Under the same material, the thinner the thickness, the lower the thermal resistance and the higher the thermal conductivity efficiency.
5. Built-in substrate: In some cases, in order to enhance the tensile strength, the thermal conductive silicone pad may have built-in reinforcement.
The method of using silicone thermal pads mainly includes steps such as cleaning the surface, cutting the size, pasting the gasket, removing bubbles and fixing the installation. At the same time, some matters need to be paid attention to during use to ensure its performance.