High-Quality Thermal Pads from China Suppliers | Factory Direct Cooling Solutions for Optimal Performance
Product Introduction
Silicone thermal pads are cost-effective, versatile, and economical thermal gap fillers. They are soft, slightly sticky, and easy to assemble. Their low compression force exhibits excellent thermal conductivity and electrical insulation. When placed between a heating device and a heat sink or device housing, they squeeze out air, ensuring full contact and forming a continuous thermal path. Using the heat sink or device housing as a heat sink effectively increases the heat dissipation area, achieving optimal heat dissipation.
Product physical property table
| Product physical property table | |||||
| Test project | Unit | TP120 | TP200 | TP300 | Test Method |
| Color | - | Grayish-white | Blue | Blue | Visual |
| Thickness | m m | 0.3-15 | 0.3-10 | 0.3-10 | ASTM D374/374M |
| Hardness | Shore A0 | 30±5 | 30±5 | 30±5 | GB/T531 |
| Specific Gravity | g/cm3 | 2.07 | 2.74 | 3.0 | ASTM D792 |
| Tensile Strength | Mpa | 0.34 | 0.26 | 0.19 | ASTM D412 |
| Elongation at Break | % | 100 | 80 | 40 | ASTM D412 |
| Tear Strength | KN/m | 1.4 | 0.8 | 0.9 | ASTM D624 |
| Breakdown Voltage | KV/mm | ≥10 | ≥10 | ≥10 | ASTM D149 |
| Volume Resistivity | Ω-cm | 1x1013 | 1x1013 | 1x1013 | ASTM D257 |
| Temperature Resistance Range | ℃ | -40~200 | -40~200 | -40~200 | - |
| Fire Resistance Performance | - | V-0 | V-0 | V-0 | UL 94 |
| Weight Loss | % | ≤0.3 | ≤0.3 | ≤0.3 | @150℃240H |
| Dielectric Constant | @1MHz | 5.41 | 6.28 | 7.0 | ASTM D150 |
| Thermal Conductivity | W/m·K | 1.2 | 2.0 | 3.0 | IS0 22007-2 |
| Thermal Impedance | ℃·in2/w | 1.108 | 0.787 | 0.483 | ASTM D5470 |
| Remark: The parameters in the table were measured from a 2mm standard sample. The thermal impedance test conditions are as follows: thickness 1MM, pressure 40psi, and average temperature 50℃. | |||||
| Basic specifications: It can be cut or die-cut into different shapes and sizes according to usage requirements. You can choose to add fiberglass base material/back silicone adhesive tape/back adhesive. | |||||
Applications
Product Features
- Wide range of thickness, can fill any uneven gaps of any size;
- Low cost, high efficiency, high cost performance, can replace volatile thermal grease;
- High electrical insulation performance, effectively protect electronic components;
- Natural viscosity, easy to assemble, can be repeatedly disassembled and assembled.
Main categories
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Frequently Asked Questions
1. What is silicone thermal pad?
Silicone thermal pad is a soft thermal conductive medium made of silicone rubber as the base and filled with high thermal conductivity insulating materials. It is specially used for heat transfer between heat-generating components and heat sinks in electronic equipment. Its core function is to fill the microscopic gaps on the contact surface, reduce the interface thermal resistance, and thus efficiently conduct heat, while providing electrical insulation and mechanical buffer protection.
2. How to choose the right silicone thermal pad?
1. Thermal conductivity (thermal conductivity): The higher the thermal conductivity, the lower the thermal resistance and the better the thermal conductivity.
2. Thickness: The thickness of the thermal conductive silicone pad will affect its thermal resistance and heat dissipation effect. Thinner thermal conductive silicone pads have low thermal resistance and good heat transfer effect.
3. Hardness and softness: Gaskets with low hardness and good softness are easier to fit the surface of the radiator or heat source, reduce contact thermal resistance and improve heat dissipation effect.
4. Working temperature range: Different equipment has different working temperature requirements. When choosing a thermal conductive silicone pad, ensure that its working temperature range is suitable for the equipment's use environment.
Other factors: The pressure resistance, toughness, silicone oil content, voltage resistance, fire rating and other factors of the thermal conductive silicone pad.
3. Application areas of silicone thermal pads?
Thermal conductive pads are widely used in many fields such as electronic products, medical applications, automotive industry, aerospace, home appliances, power supply industry, LED industry and PC equipment.
4. What are the factors that affect the thermal conductivity of silicone thermal pads?
1. Type and characteristics of polymer matrix materials: The higher the thermal conductivity of the matrix material, the better the thermal conductivity is generally.
2. Type, shape and content of fillers: The higher the thermal conductivity of the filler, the better the thermal conductivity of the thermally conductive composite material. The order of the shape of the filler to form a thermal conductive path is: whisker > fiber > flake > granular.
3. The higher the humidity, the worse the thermal conductivity
4. Thickness: Under the same material, the thinner the thickness, the lower the thermal resistance and the higher the thermal conductivity efficiency.
5. Built-in substrate: In some cases, in order to enhance the tensile strength, the thermal conductive silicone pad may have built-in reinforcement.
5. Correct use and precautions of silicone thermal pads?
The method of using silicone thermal pads mainly includes steps such as cleaning the surface, cutting the size, pasting the gasket, removing bubbles and fixing the installation. At the same time, some matters need to be paid attention to during use to ensure its performance.