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High Thermal Conductivity Silicone Pads - Quality Thermal Solutions from China Suppliers and Factory
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High Thermal Conductivity Silicone Pads - Quality Thermal Solutions from China Suppliers and Factory

Introducing our ODM Custom Thermal Pads, expertly designed to address the diverse thermal management needs of various industries. As leading China suppliers, we offer exceptional heat dissipation and thermal conductivity, ensuring optimal performance and reliability for your electronic devices. With our advanced thermal pads, you can effectively eliminate overheating issues and boost thermal efficiency. Upgrade your cooling systems today and safeguard your valuable electronics with this superior solution from our factory. Experience unparalleled thermal performance and reliability with our high-quality thermal pads

    Product Introduction

    High thermal conductivity silicone sheet is a material with high thermal conductivity. The raw materials are made of high thermal conductivity spherical alumina powder and high molecular polymer. It is a cost-effective thermal conductive filling material. The natural micro-stickiness and softness of the surface effectively fill the gap, complete the heat transfer between the heat source and the heat sink, and improve the thermal conductivity. It is often used in scenarios with high performance thermal conductivity requirements and is an ideal thermal conductive interface material.

    Product Physical Property Table

    Product physical property table
    Test project Unit TP400 TP500 TP600 Test Method
    Color - Grey Grey Grey Visual
    Thickness m m 0.5-5.0 0.5-5.0 0.5-5.0 ASTM D374/374M
    Hardness Shore A0 30±5 30±5 30±5 GB/T531
    Specific Gravity g/cm3 3.24 3.32 3.43 ASTM D792
    Tensile Strength Mpa 0.14 0.20 0.22 ASTM D412
    Elongation at Break % 32 60 16 ASTM D412
    Tear Strength KN/m 0.70 0.50 0.50 ASTM D624
    Breakdown Voltage KV/mm ≥8 ≥7 ≥7 ASTM D149
    Volume Resistivity Ω-cm 1x1013 1x1013 1x1013 ASTM D257
    Temperature Resistance Range -40~200 -40~200 -40~200 -
    Fire Resistance Performance - V-0 V-0 V-0 UL 94
    Weight Loss % ≤0.2 ≤0.2 ≤0.2 @150℃240H
    Dielectric Constant @1MHz 6.75 7.92 7.47 ASTM D150
    Thermal Conductivity W/m·K 4.0 5.0 6.0 IS0 22007-2
    Thermal Impedance ℃·in2/w 0.340 0.295 0.188 ASTM D5470

    Applications

    New energy vehicles
    Network communication equipment
    High-speed hard disk drives
    Vehicle-mounted equipment
    Chargers
    High thermal conductivity heating
    Microprocessors, memory chips and graphics processors

    Product Features

    • Wide range of thickness; can fill any uneven gaps of any size.
    • Low thermal resistance, high thermal conductivity, high cost performance.
    • High conformability, soft and elastic, reducing interface thermal resistance.
    • Natural viscosity, easy to assemble, and can be disassembled repeatedly.

    Main Categories

    1. Thermal pad
    2. High thermal conductivity silicone pad
    3. Ultra-high thermal conductivity silicone pad
    4. Thermal conductive pad with silicone rubber cloth
    5. With glass fiber thermal pad
    6. Covered with Single Sided Tape Thermal Pad

    Download

    Thermal pad--CMAl Catalog
    Thermal pad--CMAl Catalog

    Frequently Asked Questions

    1. What is silicone thermal pad?

    Silicone thermal pad is a soft thermal conductive medium made of silicone rubber as the base and filled with high thermal conductivity insulating materials. It is specially used for heat transfer between heat-generating components and heat sinks in electronic equipment. Its core function is to fill the microscopic gaps on the contact surface, reduce the interface thermal resistance, and thus efficiently conduct heat, while providing electrical insulation and mechanical buffer protection.

    2. How to choose the right silicone thermal pad?

    1. Thermal conductivity: The higher the thermal conductivity, the lower the thermal resistance and the better the thermal conductivity.

    2. Thickness: The thickness will affect its thermal resistance and heat dissipation effect. Thinner pads have low thermal resistance and better heat transfer.

    3. Hardness and softness: Gaskets with low hardness and good softness fit the radiator or heat source surface easier, reducing contact thermal resistance.

    4. Working temperature range: Ensure that its working temperature range is suitable for the equipment's use environment.

    5. Other factors: Pressure resistance, toughness, silicone oil content, voltage resistance, and fire rating.

    3. What are the application areas of silicone thermal pads?

    Thermal conductive pads are widely used in many fields such as electronic products, medical applications, automotive industry, aerospace, home appliances, power supply industry, LED industry and PC equipment.

    4. What factors affect the thermal conductivity of silicone thermal pads?

    1. Type and characteristics of polymer matrix materials: The higher the thermal conductivity of the matrix material, the better the thermal conductivity.

    2. Type, shape and content of fillers: The shape order to form a thermal conductive path is whisker > fiber > flake > granular.

    3. Humidity: The higher the humidity, the worse the thermal conductivity.

    4. Thickness: Under the same material, thinner thickness means lower thermal resistance and higher efficiency.

    5. Built-in substrate: In some cases, built-in reinforcements are added to enhance tensile strength.

    5. What is the correct use and precautions of silicone thermal pads?

    The method of using silicone thermal pads mainly includes steps such as cleaning the surface, cutting the size, pasting the gasket, removing bubbles and fixing the installation. At the same time, some matters need to be paid attention to during use to ensure its performance.

    6. What customization options are available for the thermal pads?

    The thermal pads can be cut or die-cut into different shapes and sizes according to usage requirements. Additionally, a fiberglass substrate or adhesive backing can be selected to meet specific application needs.