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High thermal conductivity silicone pad
Silicone Thermal Pad
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High thermal conductivity silicone pad

ODM Custom Diverse Thermal Pad Designs. Designed to meet the diverse needs of various industries, CMAI's thermal pads offer exceptional heat dissipation and thermal conductivity, ensuring optimal performance and reliability for your electronic devices.Say goodbye to overheating problems and increase thermal efficiency with thermal pads. Upgrade your cooling system and protect your valuable electronics with this superior thermal management solution.

    Product Introduction

    High thermal conductivity silicone sheet is a material with high thermal conductivity. The raw materials are made of high thermal conductivity spherical alumina powder and high molecular polymer. It is a cost-effective thermal conductive filling material. The natural micro-stickiness and softness of the surface effectively fill the gap, complete the heat transfer between the heat source and the heat sink, and improve the thermal conductivity. It is often used in scenarios with high performance thermal conductivity requirements and is an ideal thermal conductive interface material.

    Product physical property table

    Product physical property table

    Test project

    Unit

    TP400

    TP500

    TP600

    Test Method

    Color

    -

    Grey

    Grey

    Grey

    Visual

    Thickness

    m m

    0.5-5.0

    0.5-5.0

    0.5-5.0

    ASTM D374/374M

    Hardness

    Shore A0

    30±5

    30±5

    30±5

    GB/T531

    Specific Gravity

    g/cm3

    3.24

    3.32

    3.43

    ASTM D792

    Tensile Strength

    Mpa

    0.14

    0.20

    0.22

    ASTM D412

    Elongation at Break

    %

    32

    60

    16

    ASTM D412

    Tear Strength

    KN/m

    0.70

    0.50

    0.50

    ASTM D624

    Breakdown Voltage

    KV/mm

    ≥8

    ≥7

    ≥7

    ASTM D149

    Volume Resistivity

    Ω-cm

    1x1013

    1x1013

    1x1013

    ASTM D257

    Temperature Resistance Range

    -40~200

    -40~200

    -40~200

    -

    Fire Resistance Performance

    -

    V-0

    V-0

    V-0

    UL 94

    Weight Loss

    %

    ≤0.2

    ≤0.2

    ≤0.2

    @150℃240H

    Dielectric Constant

    @1MHz

    6.75

    7.92

    7.47

    ASTM D150

    Thermal Conductivity

    W/m·K

    4.0

    5.0

    6.0

    IS0 22007-2

     Thermal Impedance

    ℃·in2/w

    0.340

    0.295

    0.188

    ASTM D5470

    Remark:The parameters in the table were measured from a 2mm standard sample. The thermal impedance test conditions are as follows: thickness 1MM, pressure 40psi, and average temperature 50℃.

    Basic specifications: It can be cut or die-cut into different shapes and sizes according to usage requirements, and fiberglass substrate or adhesive backing can be selected.

    Applications

    New energy vehicles, network communication equipment, high-speed hard disk drives, vehicle-mounted equipment, chargers, high thermal conductivity heating, microprocessors, memory chips and graphics processors.

    Product Features

    ● Wide range of thickness; can fill any uneven gaps of any size; 
    ● Low thermal resistance, high thermal conductivity, high cost performance;
    ● High conformability, soft and elastic, reducing interface thermal resistance; 
    ● Natural viscosity, easy to assemble, and can be disassembled repeatedly.

    Main categories

    1,Thermal pad
    2,High thermal conductivity silicone pad
    3,Ultra-high thermal conductivity silicone pad
    4,Thermal conductive pad with silicone rubber cloth
    5,With glass fiber thermal pad
    6,Covered with Single Sided Tape Thermal Pad

    Download

    Download_file
    Thermal pad--CMAl Catal
    • 1. What is silicone thermal pad?

    • 2. How to choose the right silicone thermal pad?

    • 3. Application areas of silicone thermal pads?

    • 4. What are the factors that affect the thermal conductivity of silicone thermal pads?

    • 5. Correct use and precautions of silicone thermal pads?

    description2

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