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Thermal  Pad
Silicone Thermal Pad
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Thermal Pad

Thermal pads are an essential component for anyone looking to optimize the cooling performance of their electronic devices. This high-quality thermal pad is designed to efficiently transfer heat away from sensitive components, ensuring optimal operating temperatures and preventing overheating.

    Product Introduction

    Silicone thermal pads are cost-effective, versatile, and economical thermal gap fillers. They are soft, slightly sticky, and easy to assemble. Their low compression force exhibits excellent thermal conductivity and electrical insulation. When placed between a heating device and a heat sink or device housing, they squeeze out air, ensuring full contact and forming a continuous thermal path. Using the heat sink or device housing as a heat sink effectively increases the heat dissipation area, achieving optimal heat dissipation.

    Product physical property table

    Product physical property table

    Test project

    Unit

    TP120

    TP200

    TP300

    Test Method

    Color

    -

    Grayish-white

    Blue

    Blue

    Visual

    Thickness

    m m

    0.3-15

    0.3-10

    0.3-10

    ASTM D374/374M

    Hardness

    Shore A0

    30±5

    30±5

    30±5

    GB/T531

    Specific Gravity

    g/cm3

    2.07

    2.74

    3.0

    ASTM D792

    Tensile Strength

    Mpa

    0.34

    0.26

    0.19

    ASTM D412

    Elongation at Break

    %

    100

    80

    40

    ASTM D412

    Tear Strength

    KN/m

    1.4

    0.8

    0.9

    ASTM D624

    Breakdown Voltage

    KV/mm

    ≥10

    ≥10

    ≥10

    ASTM D149

    Volume Resistivity

    Ω-cm

    1x1013

    1x1013

    1x1013

    ASTM D257

    Temperature Resistance Range

    -40~200

    -40~200

    -40~200

    -

    Fire Resistance Performance

    -

    V-0

    V-0

    V-0

    UL 94

    Weight Loss

    %

    ≤0.3

    ≤0.3

    ≤0.3

    @150℃240H

    Dielectric Constant

    @1MHz

    5.41

    6.28

    7.0

    ASTM D150

    Thermal Conductivity

    W/m·K

    1.2

    2.0

    3.0

    IS0 22007-2

     Thermal Impedance

    ℃·in2/w

    1.108

    0.787

    0.483

    ASTM D5470

    Remark:The parameters in the table were measured from a 2mm standard sample. The thermal impedance test conditions are as follows: thickness 1MM, pressure 40psi, and average temperature 50℃.

    Basic specifications: It can be cut or die-cut into different shapes and sizes according to usage requirements. You can choose to add fiberglass base material/back silicone adhesive tape/back adhesive

    Applications

    Switching power supplies, on-board equipment, chargers, new energy vehicles, power batteries, computers, PC servers, workstations, tablet computers, security equipment, video equipment, communication equipment, notebook computers, optical drives, COMBOS......

    Product Features

    ● Wide range of thickness,can fill any uneven gaps of any size;
    ● Low cost, high efficiency, high cost performance, can replace volatile thermal grease; 
    ● High electrical insulation performance, effectively protect electronic components;
    ● Natural viscosity, easy to assemble, can be repeatedly disassembled and assembled.

    Main categories

    1,Thermal pad
    2,High thermal conductivity silicone pad
    3,Ultra-high thermal conductivity silicone pad
    4,Thermal conductive pad with silicone rubber cloth
    5,With glass fiber thermal pad
    6,Covered with Single Sided Tape Thermal Pad

    Download

    Download_file
    Thermal pad--CMAl Catal
    • 1. What is silicone thermal pad?

    • 2. How to choose the right silicone thermal pad?

    • 3. Application areas of silicone thermal pads?

    • 4. What are the factors that affect the thermal conductivity of silicone thermal pads?

    • 5. Correct use and precautions of silicone thermal pads?

    description2

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