Ultra-high Thermal Conductivity Silicone Pads from China Suppliers - Factory Direct Thermal Management Solutions
Product Introduction
Ultra-high thermal conductivity silicone sheet is a high-performance thermal conductive interface material made of imported raw materials. It is used to fill the air gap between the heating element and the heat sink or metal base. Its soft and elastic characteristics enable it to cover completely uneven surfaces. Heat is transferred from the separated device or the entire PCB to the metal housing or diffusion plate, effectively improving the heat dissipation performance and increasing the efficiency and service life of the heat-generating electronic components.
Product physical property table
| Product physical property table | |||||
|---|---|---|---|---|---|
| Test project | Unit | TP700 | TP800 | TP1000 | Test Method |
| Color | - | Grey | Grey | Grey | Visual |
| Thickness | mm | 0.5-5.0 | 0.5-5.0 | 1.0-5.0 | ASTM D374/374M |
| Hardness | Shore A0 | 30±5 | 30±5 | 30±5 | GB/T531 |
| Specific Gravity | g/cm³ | 3.50 | 3.55 | 3.39 | ASTM D792 |
| Tensile Strength | Mpa | 0.15 | 0.15 | 0.15 | ASTM D412 |
| Elongation at Break | % | 24 | 24 | 15 | ASTM D412 |
| Tear Strength | KN/m | 0.50 | 0.50 | 0.30 | ASTM D624 |
| Breakdown Voltage | KV/mm | ≥7 | ≥7 | ≥8 | ASTM D149 |
| Volume Resistivity | Ω-cm | 3x1011 | 3x1011 | 1x1011 | ASTM D257 |
| Temperature Resistance Range | ℃ | -40~200 | -40~200 | -40~200 | - |
| Fire Resistance Performance | - | V-0 | V-0 | V-0 | UL 94 |
| Weight Loss | % | ≤0.2 | ≤0.2 | ≤0.2 | @150℃240H |
| Dielectric Constant | @1MHz | 8.0 | 8.0 | 7.2 | ASTM D150 |
| Thermal Conductivity | W/m·K | 7.0 | 8.0 | 10.0 | ISO 22007-2 |
| Thermal Impedance | ℃·in²/w | 0.165 | 0.165 | 0.155 | ASTM D5470 |
| Remark: The parameters in the table were measured from a 2mm standard sample. The thermal impedance test conditions are as follows: thickness 1MM, pressure 40psi, and average temperature 50℃. | |||||
| Basic specifications: It can be cut or die-cut into different shapes and sizes according to usage requirements, and fiberglass substrate or adhesive backing can be selected. | |||||
Applications
Product Features
- Wide range of thickness, can fill any uneven gaps;
- Low thermal resistance, ultra-high thermal conductivity;
- High electrical insulation, protecting sensitive electronics;
- High conformability, soft and elastic, reducing interface thermal resistance;
- Natural viscosity, easy to assemble, and can be disassembled repeatedly.
Main categories
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Frequently Asked Questions
1. What is silicone thermal pad?
2. How to choose the right silicone thermal pad?
1. Thermal conductivity (thermal conductivity): The higher the thermal conductivity, the lower the thermal resistance and the better the thermal conductivity.
2. Thickness: The thickness of the thermal conductive silicone pad will affect its thermal resistance and heat dissipation effect. Thinner thermal conductive silicone pads have low thermal resistance and good heat transfer effect.
3. Hardness and softness: Gaskets with low hardness and good softness are easier to fit the surface of the radiator or heat source, reduce contact thermal resistance and improve heat dissipation effect.
4. Working temperature range: Different equipment has different working temperature requirements. When choosing a thermal conductive silicone pad, ensure that its working temperature range is suitable for the equipment's use environment.
Other factors: The pressure resistance, toughness, silicone oil content, voltage resistance, fire rating and other factors of the thermal conductive silicone pad.
3. Application areas of silicone thermal pads?
4. What are the factors that affect the thermal conductivity of silicone thermal pads?
1. Type and characteristics of polymer matrix materials: The higher the thermal conductivity of the matrix material, the better the thermal conductivity is generally.
2. Type, shape and content of fillers: The higher the thermal conductivity of the filler, the better the thermal conductivity of the thermally conductive composite material. The order of the shape of the filler to form a thermal conductive path is: whisker > fiber > flake > granular.
3. The higher the humidity, the worse the thermal conductivity.
4. Thickness: Under the same material, the thinner the thickness, the lower the thermal resistance and the higher the thermal conductivity efficiency.
5. Built-in substrate: In some cases, in order to enhance the tensile strength, the thermal conductive silicone pad may have built-in reinforcement.