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With glass fiber thermal pad
Silicone Thermal Pad
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With glass fiber thermal pad

ODM Custom Diverse Thermal Pad Designs. Designed to meet the diverse needs of various industries, CMAI's thermal pads offer exceptional heat dissipation and thermal conductivity, ensuring optimal performance and reliability for your electronic devices.Say goodbye to overheating problems and increase thermal efficiency with thermal pads. Upgrade your cooling system and protect your valuable electronics with this superior thermal management solution.

    Product Introduction

    This is a thermal conductive material coated with a thermal conductive polymer on a layer of glass fiber mesh. The upper side of the material has a slightly weaker viscosity, which is convenient for construction operation. It also has better insulation effect and tear resistance. It has the characteristics of being conformable and elastic, and can provide good thermal conductive filling effects even on relatively rough and uneven surfaces.

    Product physical property table

    Product physical property table

    Test project

    Unit

    TP120

    TP200

    TP300

    Test Method

    Color

    -

    Grayish-white

    Blue

    Blue 

    Visual

    Thickness

    m m

    0.3-15

    0.3-10

    0.3-10

    ASTM D374/374M

    Hardness

    Shore A0

    30±5

    30±5

    30±5

    GB/T531

    Specific Gravity

    g/cm3

    2.07

    2.74

    3.0

    ASTM D792

    Tensile Strength

    Mpa

    0.34

    0.26

    0.19

    ASTM D412

    Elongation at Break

    %

    100

    80

    40

    ASTM D412

    Tear Strength

    KN/m

    1.4

    0.80

    0.90

    ASTM D624

    Breakdown Voltage

    KV/mm

    ≥10

    ≥10

    ≥10

    ASTM D149

    Volume Resistivity

    Ω-cm

    3x1013

    3x1013

    1x1013

    ASTM D257

    Temperature Resistance Range

    -40~150

    -40~200

    -40~200

    -

    Fire Resistance Performance

    -

    V-0

    V-0

    V-0

    UL 94

    Weight Loss

    %

    ≤0.3

    ≤0.3

    ≤0.3

    @150℃240H

    Dielectric Constant

    @1MHz

    5.41

    6.28

    7.0

    ASTM D150

    Thermal Conductivity

    W/m·K

    1.2

    2.0

    3.0

    IS0 22007-2

     Thermal Impedance

    ℃·in2/w

    1.108

    0.787

    0.483

    ASTM D5470

    Remark:The parameters in the table were measured from a 2mm standard sample. The thermal impedance test conditions are as follows: thickness 1MM, pressure 40psi, and average temperature 50℃.

    Basic specifications: It can be cut or die-cut into different shapes and sizes according to usage requirements.

    Applications

    Between the motherboard and the case ,AC/DC power supply,Vehicle-mounted equipment/charger ,Uninterruptible Power Supply (UPS) ,Thermal components for transmission control ,Power semiconductors - TO package products.

    Product Features

    ● Glass fiber substrate, puncture resistance, shear resistance, tear resistance
    ● High electrical insulation, 
    ● High conformability and low hardness
    ● The fiberglass surface is relatively weak, making it easy to install.

    Main categories

    1,Thermal pad
    2,High thermal conductivity silicone pad
    3,Ultra-high thermal conductivity silicone pad
    4,Thermal conductive pad with silicone rubber cloth
    5,With glass fiber thermal pad
    6,Covered with Single Sided Tape Thermal Pad

    Download

    Download_file
    Thermal pad--CMAl Catal
    • 1. What is silicone thermal pad?

    • 2. How to choose the right silicone thermal pad?

    • 3. Application areas of silicone thermal pads?

    • 4. What are the factors that affect the thermal conductivity of silicone thermal pads?

    • 5. Correct use and precautions of silicone thermal pads?

    description2

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