Ukutyhila isitshixo sokuSebenza kweSilicone Thermal Pad: Izinto ezintlanu ezingundoqo zimisela i-Thermal Conductivity

Njengoko izixhobo zombane zihambela phambili ekusebenzeni okuphezulu kunye nobukhulu obuncinci, ukukhutshwa kobushushu kuye kwaba yinto ephambili ethintela impumelelo yetekhnoloji. Njengezinto ezingundoqo kulawulo lwe-thermal, i Thermal Cukusebenza kweiipads ze-silicone thermalimisela ngokuthe ngqo ukusebenza kakuhle kokutshatyalaliswa kobushushu. Ke, zeziphi izinto ezilawula lo msebenzi ubalulekileyo? Eli nqaku, lizoba kuphando lweshishini, libonelela ngohlalutyo olunzulu lwemiba emihlanu ephambili enempembelelo kunye nengqiqo yesayensi emva kwabo.

1. Iipropati zokugcwalisa: "I-Skeleton" ye-Thermal Path

Uhlobo lokuzalisa, umxholo, kunye nokuhanjiswa zizinto eziphambili ezichaphazela ukusebenza kwe iipads ze-silicone thermal. Uphando lubonise ukuba kakhulu thermally Iyaqhuba izihluzi ezifana ne-alumina kunye ne-boron nitride zinokwenza indlela esebenzayo yokuqhuba ubushushu ngokusasazwa okufanayo. Ngokomzekelo, xa i-whiskers okanye i-fibrous fillers ihambelana, i-thermal conductivity inokunyuswa ngaphezu kwe-30%. Nangona kunjalo, ukongezwa kokugcwalisa okugqithisileyo kunokunciphisa ukuguquguquka kwezinto kunye nokwandisa ukuxhathisa kwe-thermal.

2. Iqondo lobushushu kunye nokufuma: Imingeni eMibini yoGuquguquko lweNdalo. Thermal

conductivity ye iipads ze-silicone thermalayimi. Kwiindawo ezinobushushu obuphezulu, ezinye izinto zinokufumana ukuguga kwe-thermal, okukhokelela ekuqhekekeni kwenethiwekhi ye-thermal. Umswakama ophezulu, ngakolunye uhlangothi, unokubangela ukuba isigcwalisi sithathe umswakama, sinciphise ukuhanjiswa kwe-thermal. Ke ngoko, kwiindawo ezinobushushu obuphezulu kunye nobushushu obuphezulu, njengeepakethi zebhetri yemoto yombane, zilungisiwe.izinto ze-siliconekunye nokumelana nemozulu okwandisiweyo kuyafuneka.

2. Uyilo loLwakhiwo: UbuGcisa bokulinganisa ukutyeba kunye nokuNxinzelela

Ukutyeba likrele elintlangothi-mbini ye-thermal conductivity. Ngelixa umncinci kakhulu unokunciphisa umgama wokuqhuba ubushushu, kunokukhokelela ekuzalisweni okunganeleyo. Ukutyeba kakhulu kunokunyusa ukuxhathisa kwe-thermal kwaye kwenze buthathaka isiphumo sokutshatyalaliswa kobushushu. Ngaphaya koko, ukusebenza kweseti yoxinzelelo kubalulekile- ukomelela okugqwesileyo kuqinisekisa ukulingana okuqinileyo naphantsi koxinzelelo olude, ukuthintela izithuba zomoya ekudaleni ukuxhathisa ubushushu.

3. I-Substrate kunye neNkqubo: Ulawulo oluchanekileyo kwiNqanaba leMolekyuli

Ubunyulu be abicah i-substrate kunye nenkqubo yokuxuba ichaphazela ngokuthe ngqo ukufana kwe-filler dispersion. Ukuchaneka kokucubungula okungonelanga kunokukhokelela ekuqokeleleni kwesihlungi sendawo, ukuthintela ukuhanjiswa kwe-thermal. Ngaphezu koko, idizayini yokuncamathela ye-substrate (efana ne-self-adhesive backing) ifuna ukulingana phakathi kokulula kunye nokumelana nokushisa. Ezinye i-adhesive backings zinokunyusa ukuxhathisa kwe-thermal ukuya kuma-20%.

5. Iimeko zeSicelo: Umdlalo ochanekileyo ukusuka kwiThiyori ukuya kuQeqesho

I-conductivity ephezulu ye-thermal ayikho i-panacea. Iingcali zoshishino zibonisa ukuba iimfuno ze-thermal conductivity zabaqhubi be-LED kunye ne-electronics zabathengi zihluke kakhulu, zifuna ukuqwalaselwa ngokubanzi koxinzelelo lokutshatyalaliswa kobushushu, iindleko, kunye nokhuseleko (njengokumelana nombane kunye nokulinganisa umlilo). Umzekelo, iipakethi zebhetri zamandla zifuna i-thermal conductivity enkulu kune-5W/mK, ngelixa iimveliso zombane eziqhelekileyo zifuna kuphela i-1-3W/mK.

6. Uphuhliso lwexesha elizayo

Ngokwamkelwa ngokubanzi kwezixhobo ze-semiconductor zesizukulwana sesithathu, iipads ze-silicone thermalziphuhlisa ukuya kwi-thermal conductivity ephezulu (>10W/mK), ukuxhathisa okuphantsi kwe-thermal, kunye nokubhitya kakhulu (ngaphantsi kwe-0.1mm). Ulutsha olusebenzisanayo kwisayensi yezinto kunye neteknoloji yenkqubo iya kuqhubeka nokubonelela ngezisombululo eziphuculweyo kwimingeni yokutshatyalaliswa kobushushu ejongene nezixhobo zombane.

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