ODM isiko conductive zebra isinxibelelanisi

Into

Ikhowudi

Iyunithi

0.05P

0.10P

0.18P

I-pitch

P

mm

0.05±0.015

0.10±0.03

0.18±0.04

Ubude

L

mm

1.0~24.0±0.10 24.1~50.0±0.15

50.1~100.0±0.20 100.1~200.0±0.30

Ubude

H

mm

0.8~7.0±0.10 7.1~15.0±0.15

Ububanzi

IN

mm

1.0~2.5±0.15 2.5~4.0±0.20

Ukuqhuba ububanzi

TC

mm

0.025±0.01

0.05±0.02

0.09±0.03

Ububanzi be-insulator

OF

mm

0.025±0.01

0.05±0.02

0.09±0.03

Ububanzi obungundoqo

CW

mm

0.2~1.0±0.05 1.1~4.0±0.10

Imigca lope

≤2°

Phawula

Ukuze wenze izihlanganisi zisebenze kakuhle, i

umda woxinzelelo lwecala lokuphakama kwe

izihlanganisi kufuneka zibe phakathi kwe-8.0% ~ 15%, kwaye zingcono

ixabiso loxinzelelo yi-10%, kunye nokuchukumisa okufanelekileyo

uxinzelelo bukhulu kuno 20g/mm×ubude.

Ubude (mm)

Ubude (mm)

Ububanzi (mm)

I-pitch

Ubude beglasi

ukunciphisa 0.5mm

Ubude phakathi

LCD kunye nePCB ×

(1.08 ~ 1.15).Ngamanye amazwi, i

umlinganiselo wembonakalo

yi 8% ~15%, kwaye

owona mfanekiso ulungileyo

umlinganiselo yi-10%.

Ububanzi bomphetho

ye LCD

×(0.9~0.95)

Umlinganiselo phakathi

umnwe ngamnye wegolide

ububanzi PCB kunye

i-conductive

isinxibelelanisi serabha

kufuneka ibe ngaphezu

3 ~ 5.Ngamanye amazwi, igolide nganye

umnwe ufuna touch

3 ~ 5 ukuqhuba

umaleko ukwenza

i-conductive ngokuqinisekileyo.